Página 171 - Soquetes para CIs, Transistores | Conectores, interconectores | Heisener Electronics
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Soquetes para CIs, Transistores

Registros 11.083
Página  171/396
Imagem
Nº de peças
Fabricante
Descrição
pacote
Estoque
Quantidade
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
0479890112
Molex, LLC

CONN SOCKET PGA 989POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 989 (35 x 36)
  • Pitch - Mating: 0.039" (1.00mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.039" (1.00mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
pacote: -
Estoque2.502
989 (35 x 36)
0.039" (1.00mm)
Gold
15µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.039" (1.00mm)
-
-
-
Liquid Crystal Polymer (LCP)
-
641855-1
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS TIN

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Thermoplastic
  • Operating Temperature: -55°C ~ 125°C
pacote: -
Estoque3.186
24 (2 x 12)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic
-55°C ~ 125°C
1-390263-4
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS TIN

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 40 (2 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 60µin (1.52µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 60µin (1.52µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: -
  • Operating Temperature: -40°C ~ 105°C
pacote: -
Estoque2.826
40 (2 x 20)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
-
-40°C ~ 105°C
4-1437530-7
TE Connectivity AMP Connectors

CONN SOCKET SIP 3POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 3 (1 x 3)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Thermoplastic
  • Operating Temperature: -
pacote: -
Estoque2.412
3 (1 x 3)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
-
Beryllium Copper
Thermoplastic
-
1437538-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: -
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Polyester
  • Operating Temperature: -55°C ~ 105°C
pacote: -
Estoque8.244
28 (2 x 14)
0.100" (2.54mm)
-
-
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
-
-
-
Polyester
-55°C ~ 105°C
100-022-000
3M

CONN IC DIP SOCKET 22POS GOLD

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 22 (2 x 11)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 8µin (0.20µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: Flash
  • Contact Material - Post: Brass
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -65°C ~ 125°C
pacote: -
Estoque8.802
22 (2 x 11)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
100-018-001
3M

CONN IC DIP SOCKET 18POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 18 (2 x 9)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 8µin (0.20µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame, Seal Tape
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: Flash
  • Contact Material - Post: Brass
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -65°C ~ 125°C
pacote: -
Estoque8.604
18 (2 x 9)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Closed Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
2-822114-3
TE Connectivity AMP Connectors

CONN SOCKET PQFP 144POS TIN-LEAD

  • Type: QFP
  • Number of Positions or Pins (Grid): 144 (4 x 36)
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin-Lead
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
pacote: -
Estoque3.580
144 (4 x 36)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
Phosphor Bronze
Liquid Crystal Polymer (LCP)
-
168-PRS17011-12
Aries Electronics

CONN SOCKET PGA ZIF GOLD

  • Type: PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid): -
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -65°C ~ 125°C
pacote: -
Estoque6.426
-
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-65°C ~ 125°C
28-6552-16
Aries Electronics

CONN IC DIP SOCKET ZIF 28POS

  • Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Nickel Boron
  • Contact Finish Thickness - Mating: 50µin (1.27µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Nickel Boron
  • Contact Finish Thickness - Post: 50µin (1.27µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -
pacote: -
Estoque2.106
28 (2 x 14)
0.100" (2.54mm)
Nickel Boron
50µin (1.27µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Nickel Boron
50µin (1.27µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
614-87-238-19-101112
Preci-Dip

CONN SOCKET PGA 238POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 238 (19 x 19)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
pacote: -
Estoque8.604
238 (19 x 19)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
84-PGM13042-50
Aries Electronics

CONN SOCKET PGA GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): -
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
pacote: -
Estoque4.122
-
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
40-6572-10
Aries Electronics

CONN IC DIP SOCKET ZIF 40POS TIN

  • Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 40 (2 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -
pacote: -
Estoque3.816
40 (2 x 20)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
510-83-223-18-093101
Preci-Dip

CONN SOCKET PGA 223POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 223 (18 x 18)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
pacote: -
Estoque4.194
223 (18 x 18)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
24-81000-610C
Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame, Elevated
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
pacote: -
Estoque6.246
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame, Elevated
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
111-93-328-41-001000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass Alloy
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
pacote: -
Estoque4.122
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
346-43-140-41-013000
Mill-Max Manufacturing Corp.

CONN SOCKET SIP 40POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 40 (1 x 40)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Press-Fit
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass Alloy
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
pacote: -
Estoque5.562
40 (1 x 40)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Press-Fit
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
23-0518-11H
Aries Electronics

CONN SOCKET SIP 23POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 23 (1 x 23)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
pacote: -
Estoque6.822
23 (1 x 23)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
116-87-652-41-009101
Preci-Dip

CONN IC DIP SOCKET 52POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 52 (2 x 26)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
pacote: -
Estoque2.880
52 (2 x 26)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
612-83-964-41-001101
Preci-Dip

CONN IC DIP SOCKET 64POS GOLD

  • Type: DIP, 0.9" (22.86mm) Row Spacing
  • Number of Positions or Pins (Grid): 64 (2 x 32)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
pacote: -
Estoque6.480
64 (2 x 32)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
08-6503-30
Aries Electronics

CONN IC DIP SOCKET 8POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 8 (2 x 4)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
pacote: -
Estoque4.518
8 (2 x 4)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
10-0517-90C
Aries Electronics

CONN SOCKET SIP 10POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 10 (1 x 10)
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole, Right Angle
  • Features: -
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
pacote: -
Estoque2.556
10 (1 x 10)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle
-
Solder
-
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
08-1508-30
Aries Electronics

CONN IC DIP SOCKET 8POS GOLD

  • Type: DIP, 0.2" (5.08mm) Row Spacing
  • Number of Positions or Pins (Grid): 8 (2 x 4)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6
  • Operating Temperature: -55°C ~ 105°C
pacote: -
Estoque8.748
8 (2 x 4)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6
-55°C ~ 105°C
20-4518-10T
Aries Electronics

CONN IC DIP SOCKET 20POS GOLD

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
pacote: -
Estoque7.956
20 (2 x 10)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
299-87-306-11-001101
Preci-Dip

CONN IC DIP SOCKET 6POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 6 (2 x 3)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole, Right Angle, Horizontal
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
pacote: -
Estoque2.448
6 (2 x 3)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
614-87-316-31-012101
Preci-Dip

CONN IC DIP SOCKET 16POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 16 (2 x 8)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
pacote: -
Estoque3.600
16 (2 x 8)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
110-83-306-41-001101
Preci-Dip

CONN IC DIP SOCKET 6POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 6 (2 x 3)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
pacote: -
Estoque6.804
6 (2 x 3)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
299-43-324-11-001000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 24POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole, Right Angle, Horizontal
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass Alloy
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
pacote: -
Estoque6.864
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C