Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity AMP Connectors |
CONN SOCKET SIP 64POS GOLD
|
pacote: - |
Estoque3.708 |
|
64 (1 x 64) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Brass | Thermoplastic, Polyester | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 19POS TIN
|
pacote: - |
Estoque6.174 |
|
19 (1 x 19) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS GOLD
|
pacote: - |
Estoque2.016 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 36POS
|
pacote: - |
Estoque7.668 |
|
36 (2 x 18) | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 30POS GOLD
|
pacote: - |
Estoque3.942 |
|
30 (2 x 15) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN SOCKET PGA 182POS GOLD
|
pacote: - |
Estoque2.016 |
|
182 (14 x 14) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS GLD
|
pacote: - |
Estoque7.632 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 22POS GOLD
|
pacote: - |
Estoque7.992 |
|
22 (2 x 11) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 6POS GOLD
|
pacote: - |
Estoque7.848 |
|
6 (2 x 3) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 46POS GOLD
|
pacote: - |
Estoque3.526 |
|
46 (2 x 23) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN SOCKET SIP 57POS GOLD
|
pacote: - |
Estoque3.078 |
|
57 (1 x 57) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 10POS GOLD
|
pacote: - |
Estoque7.830 |
|
10 (2 x 5) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
|
pacote: - |
Estoque6.048 |
|
18 (2 x 9) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Samtec Inc. |
ADAPTOR PLUG
|
pacote: - |
Estoque8.712 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Preci-Dip |
CONN IC DIP SOCKET 42POS GOLD
|
pacote: - |
Estoque6.444 |
|
42 (2 x 21) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET SIP 9POS GOLD
|
pacote: - |
Estoque3.960 |
|
9 (1 x 9) | - | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle | - | Solder | - | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 4POS GOLD
|
pacote: - |
Estoque5.238 |
|
4 (2 x 2) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Preci-Dip |
CONN IC DIP SOCKET 24POS GOLD
|
pacote: - |
Estoque6.354 |
|
24 (2 x 12) | 0.070" (1.78mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
pacote: - |
Estoque4.032 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 16POS GOLD
|
pacote: - |
Estoque2.250 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Preci-Dip |
CONN IC DIP SOCKET 20POS GOLD
|
pacote: - |
Estoque2.808 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN IC DIP SOCKET 8POS GOLD
|
pacote: - |
Estoque6.876 |
|
8 (2 x 4) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN IC DIP SOCKET 16POS GOLD
|
pacote: - |
Estoque6.696 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN IC DIP SOCKET 4POS GOLD
|
pacote: - |
Estoque7.902 |
|
4 (2 x 2) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 16POS GOLD
|
pacote: - |
Estoque5.562 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Preci-Dip |
CONN IC DIP SOCKET 40POS GOLD
|
pacote: - |
Estoque16.296 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, No Center Bar | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
On Shore Technology Inc. |
CONN IC DIP SOCKET 28POS GOLD
|
pacote: - |
Estoque17.124 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 80µin (2.03µm) | Brass | Thermoplastic, Polyester, Glass Filled | -40°C ~ 105°C |
||
3M |
CONN SOCKET QFN 48POS GOLD
|
pacote: - |
Estoque6.156 |
|
48 (4 x 12) | 0.016" (0.40mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |