Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS GLD
|
pacote: - |
Estoque8.784 |
|
48 (2 x 24) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS TIN
|
pacote: - |
Estoque2.934 |
|
48 (2 x 24) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
pacote: - |
Estoque3.436 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
pacote: - |
Estoque4.932 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS TIN
|
pacote: - |
Estoque2.556 |
|
44 (2 x 22) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS TIN
|
pacote: - |
Estoque3.672 |
|
44 (2 x 22) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS TIN
|
pacote: - |
Estoque5.058 |
|
44 (2 x 22) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS TIN
|
pacote: - |
Estoque5.976 |
|
44 (2 x 22) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
pacote: - |
Estoque3.078 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
pacote: - |
Estoque3.996 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS TIN
|
pacote: - |
Estoque2.376 |
|
42 (2 x 21) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS TIN
|
pacote: - |
Estoque7.776 |
|
42 (2 x 21) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS TIN
|
pacote: - |
Estoque4.320 |
|
42 (2 x 21) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS TIN
|
pacote: - |
Estoque6.858 |
|
42 (2 x 21) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
pacote: - |
Estoque3.852 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS
|
pacote: - |
Estoque7.740 |
|
48 (2 x 24) | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS
|
pacote: - |
Estoque6.192 |
|
48 (2 x 24) | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS TIN
|
pacote: - |
Estoque3.384 |
|
40 (2 x 20) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS GLD
|
pacote: - |
Estoque6.984 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS TIN
|
pacote: - |
Estoque3.384 |
|
40 (2 x 20) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS GLD
|
pacote: - |
Estoque8.262 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
pacote: - |
Estoque4.500 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
pacote: - |
Estoque7.794 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
pacote: - |
Estoque4.716 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
pacote: - |
Estoque2.664 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
pacote: - |
Estoque2.430 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
pacote: - |
Estoque4.374 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
pacote: - |
Estoque3.726 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |