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Aries Electronics Produtos - Soquetes para CIs, Transistores - Adaptadores

Registros 269
Página  6/10
Imagem
Nº de peças
Fabricante
Descrição
pacote
Estoque
Quantidade
Convert To (Adapter End)
Number of Pins
Pitch - Mating
Contact Finish - Mating
Mounting Type
Termination
Pitch - Post
Contact Finish - Post
Housing Material
Board Material
24-351000-10
Aries Electronics

SOCKET ADAPTER SSOP TO 24DIP 0.3

  • Convert From (Adapter End): SSOP
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 24
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque3.258
DIP, 0.3" (7.62mm) Row Spacing
24
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
20-351000-10
Aries Electronics

SOCKET ADAPTER SSOP TO 20DIP 0.3

  • Convert From (Adapter End): SSOP
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 20
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque8.118
DIP, 0.3" (7.62mm) Row Spacing
20
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
24-35W000-11-RC
Aries Electronics

SOCKET ADAPT SOIC-W TO 24DIP 0.3

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 24
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque3.654
DIP, 0.3" (7.62mm) Row Spacing
24
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
14-35W000-11-RC
Aries Electronics

SOCKET ADAPT SOIC-W TO 14DIP 0.3

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 14
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque6.102
DIP, 0.3" (7.62mm) Row Spacing
14
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
14-354000-21-RC
Aries Electronics

SOCKET ADAPTER DIP TO 14SOIC

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): SOIC
  • Number of Pins: 14
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
pacote: -
Estoque4.590
SOIC
14
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
14-354000-11-RC
Aries Electronics

SOCKET ADAPTER DIP TO 14SOIC

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): SOIC
  • Number of Pins: 14
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
pacote: -
Estoque7.254
SOIC
14
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
14-354000-20
Aries Electronics

SOCKET ADAPTER DIP TO 14SOIC

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): SOIC
  • Number of Pins: 14
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
pacote: -
Estoque5.544
SOIC
14
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
14-354000-10
Aries Electronics

SOCKET ADAPTER DIP TO 14SOIC

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): SOIC
  • Number of Pins: 14
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
pacote: -
Estoque3.366
SOIC
14
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
18-351000-10
Aries Electronics

SOCKET ADAPTER SSOP TO 18DIP 0.3

  • Convert From (Adapter End): SSOP
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 18
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque3.598
DIP, 0.3" (7.62mm) Row Spacing
18
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
28-35W000-11-RC
Aries Electronics

SOCKET ADAPT SOIC-W TO 28DIP 0.3

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 28
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque3.708
DIP, 0.3" (7.62mm) Row Spacing
28
-
-
Through Hole
Solder
0.050" (1.27mm)
Gold
-
FR4 Epoxy Glass
16-307349-11-RC
Aries Electronics

SOCKET ADAPTER PLCC TO 16DIP 0.3

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 16
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque7.596
DIP, 0.3" (7.62mm) Row Spacing
16
0.050" (1.27mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
16-35W000-11-RC
Aries Electronics

SOCKET ADAPT SOIC-W TO 16DIP 0.3

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 16
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque7.596
DIP, 0.3" (7.62mm) Row Spacing
16
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
18-665000-00
Aries Electronics

SCK ADAPT 18P SOIC-W TO SOIC 0.6

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): SOIC
  • Number of Pins: 18
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque4.374
SOIC
18
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
18-35W000-11-RC
Aries Electronics

SOCKET ADAPT SOIC-W TO 18DIP 0.3

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 18
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque7.758
DIP, 0.3" (7.62mm) Row Spacing
18
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
14-665000-00
Aries Electronics

SCK ADAPT 14P SOIC-W TO SOIC 0.6

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): SOIC
  • Number of Pins: 14
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque6.624
SOIC
14
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
1111903
Aries Electronics

SOCKET ADAPT SOWIC TO 24DIP 0.4

  • Convert From (Adapter End): SOWIC
  • Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
  • Number of Pins: 24
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque7.920
DIP, 0.4" (10.16mm) Row Spacing
24
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
12-665000-00
Aries Electronics

SCK ADAPT 12P SOIC-W TO SOIC 0.6

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): SOIC
  • Number of Pins: 12
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque2.016
SOIC
12
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
1107254-40
Aries Electronics

SOCKET ADAPTER DIP TO 40DIP 0.3

  • Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 40
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
pacote: -
Estoque3.762
DIP, 0.3" (7.62mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1106396-40
Aries Electronics

SOCKET ADAPTER DIP TO 40DIP 0.6

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 40
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
pacote: -
Estoque4.374
DIP, 0.6" (15.24mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
10-665000-00
Aries Electronics

SCK ADAPT 10P SOIC-W TO SOIC 0.6

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): SOIC
  • Number of Pins: 10
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque8.910
SOIC
10
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
20-350001-11-RC
Aries Electronics

SOCKET ADAPTER SOJ TO 20DIP 0.3

  • Convert From (Adapter End): SOJ
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 20
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque2.412
DIP, 0.3" (7.62mm) Row Spacing
20
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin
-
FR4 Epoxy Glass
08-665000-00
Aries Electronics

SCK ADAPT 8P SOIC-W TO SOIC 0.6

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): SOIC
  • Number of Pins: 8
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque7.758
SOIC
8
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
20-301550-20
Aries Electronics

SOCKET ADAPTER SOIC TO 20PLCC

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): PLCC
  • Number of Pins: 20
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque4.446
PLCC
20
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
20-301550-10
Aries Electronics

SOCKET ADAPTER SOIC TO 20PLCC

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): PLCC
  • Number of Pins: 20
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque4.554
PLCC
20
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
68-505-110-P
Aries Electronics

SOCKET ADAPTER PLCC TO 68PGA

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): PGA
  • Number of Pins: 68
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque7.470
PGA
68
0.050" (1.27mm)
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
12-350000-10-HT
Aries Electronics

SOCKET ADAPTER SOIC TO 12DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 12
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
pacote: -
Estoque8.802
DIP, 0.3" (7.62mm) Row Spacing
12
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
10-350000-10-HT
Aries Electronics

SOCKET ADAPTER SOIC TO 10DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 10
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
pacote: -
Estoque7.128
DIP, 0.3" (7.62mm) Row Spacing
10
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
22-304504-18
Aries Electronics

SOCKET ADAPTER SOIC TO 22DIP 0.4

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
  • Number of Pins: 22
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
pacote: -
Estoque6.822
DIP, 0.4" (10.16mm) Row Spacing
22
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass