Página 6 - Amphenol FCI Produtos - Soquetes para CIs, Transistores

Nº de peças	Fabricante	Descrição	pacote	Estoque	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
SIP41430-001LF	Amphenol FCI	CONN Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	pacote: -	Estoque3.870	-	-	-	-	-	-	-	-	-	-	-	-	-	-
54020-84030LF	Amphenol FCI	CONN SOCKET PLCC 84POS TIN Type: PLCC Number of Positions or Pins (Grid): 84 (4 x 21) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100µin (2.54µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100µin (2.54µm) Contact Material - Post: Copper Alloy Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -40°C ~ 105°C	pacote: -	Estoque5.706	84 (4 x 21)	0.050" (1.27mm)	Tin	100µin (2.54µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Tin	100µin (2.54µm)	Copper Alloy	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
54020-52030LF	Amphenol FCI	CONN SOCKET PLCC 52POS TIN Type: PLCC Number of Positions or Pins (Grid): 52 (4 x 13) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100µin (2.54µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100µin (2.54µm) Contact Material - Post: Copper Alloy Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -40°C ~ 105°C	pacote: -	Estoque6.750	52 (4 x 13)	0.050" (1.27mm)	Tin	100µin (2.54µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Tin	100µin (2.54µm)	Copper Alloy	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
54020-68030LF	Amphenol FCI	CONN SOCKET PLCC 68POS TIN Type: PLCC Number of Positions or Pins (Grid): 68 (4 x 17) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100µin (2.54µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100µin (2.54µm) Contact Material - Post: Copper Alloy Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -40°C ~ 105°C	pacote: -	Estoque2.574	68 (4 x 17)	0.050" (1.27mm)	Tin	100µin (2.54µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Tin	100µin (2.54µm)	Copper Alloy	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
69802-452LF	Amphenol FCI	CONN SOCKET PLCC 52POS TIN Type: PLCC Number of Positions or Pins (Grid): 52 (4 x 13) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150µin (3.81µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -55°C ~ 125°C	pacote: -	Estoque8.010	52 (4 x 13)	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 125°C
69802-168LF	Amphenol FCI	CONN SOCKET PLCC 68POS TIN Type: PLCC Number of Positions or Pins (Grid): 68 (4 x 17) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150µin (3.81µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -55°C ~ 125°C	pacote: -	Estoque8.532	68 (4 x 17)	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 125°C
69802-120LF	Amphenol FCI	CONN SOCKET PLCC 20POS TIN Type: PLCC Number of Positions or Pins (Grid): 20 (4 x 5) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150µin (3.81µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -55°C ~ 125°C	pacote: -	Estoque4.032	20 (4 x 5)	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 125°C