Name: XCVC1702-1MSENSVG1369
Brand: AMD
SKU: XCVC1702-1MSENSVG1369
Availability: InStock
Rating: 5 (164 reviews)

XCVC1702-1MSENSVG1369

Apenas para referência

Nº de peças	XCVC1702-1MSENSVG1369
Fabricante	AMD
Descrição	IC VERSAL AI-CORE FPGA 1369BGA
Ficha técnica
pacote	-
ECAD
Em estoque	0 piece(s)
Preço unitário	Request a Quote
Tempo de entrega	A ser confirmado
Tempo de entrega estimado	dez 30 - jan 4 (Escolha o envio acelerado)
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Especificações do XCVC1702-1MSENSVG1369

Fabricante	AMD
Categoria	Circuitos integrados - Integrado - Sistema em chip (SoC)
pacote	-
ECAD
Series	Versal™ AI Core
Arquitetura	MPU, FPGA
Processador Central	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Tamanho do Flash	-
Tamanho RAM	256KB
Periféricos	DDR, DMA, PCIe
Conectividade	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Rapidez	600MHz, 1.3GHz
Atributos Primários	Versal™ AI Core FPGA, 1M Logic Cells
Temperatura de operação	0°C ~ 100°C (TJ)
Pacote / caso	1369-BFBGA, FCBGA
Pacote de Dispositivo do Fornecedor	1369-FCBGA (35x35)

XCVC1702-1MSENSVG1369 Packaging

XCVC1702-1MSENSVG1369 FAQ

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVC1702-1MSENSVG1369.

(3)The PartNo is unused and only in the original unpacked packaging.

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XCVC1702-1MSENSVG1369

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