Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
SYSTEM BASIS CHIP, DCDC 1.5A VCO
|
pacote: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
NXP |
REGULATOR, BUCK, QUAD WITH UP TO
|
pacote: - |
Request a Quote |
|
297µA | 2.8V ~ 4.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
REGULATOR BUCK QUAD WITH UP TO 4
|
pacote: - |
Request a Quote |
|
15mA | 2.8V ~ 4.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
SYSTEM BASIS CHIP, DCDC 1.5A VCO
|
pacote: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
NXP |
REGULATOR BUCK QUAD WITH UP TO 4
|
pacote: - |
Request a Quote |
|
15mA | 2.8V ~ 4.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
AUTO SBC
|
pacote: - |
Request a Quote |
|
30µA | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
SAFETY SYSTEM BASIS CHIP WITH LO
|
pacote: - |
Request a Quote |
|
- | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
SYSTEM BASIS CHIP, DCDC 1.5A VCO
|
pacote: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
NXP |
POWER MANAGEMENT IC, I.MX8, PRE-
|
pacote: - |
Request a Quote |
|
10µA | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
SAFETY POWER MANAGEMENT IC, QFN5
|
pacote: - |
Request a Quote |
|
15mA | 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
SAFETY SYSTEM BASIS CHIP FOR DOM
|
pacote: - |
Request a Quote |
|
- | 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-HVQFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX8 PRE-PR
|
pacote: - |
Request a Quote |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
POWER MANAGEMENT IC, PRE-PROG, 4
|
pacote: - |
Request a Quote |
|
- | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 40-VFQFN Exposed Pad | 40-HVQFN (6x6) |
||
NXP |
32BIT 64K FLASH 2KB FLEX
|
pacote: - |
Request a Quote |
|
1.7mA | 3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
NXP |
DUAL 36V AUTOMOTIVE DC-DC CONTRO
|
pacote: - |
Request a Quote |
|
140µA | 2.7V ~ 36V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) |
||
NXP |
SAFETY POWER MANAGEMENT IC, QFN5
|
pacote: - |
Request a Quote |
|
15mA | 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
SYSTEM BASIS CHIP, DCDC 2.2A VCO
|
pacote: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX8 PRE-PR
|
pacote: - |
Request a Quote |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC PMIC HVQFN24
|
pacote: - |
Estoque4.200 |
|
5.5µA | 3.3V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | 24-HVQFN (3x3) |
||
NXP |
IC
|
pacote: - |
Request a Quote |
|
30µA | 5.5V ~ 40V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-HVQFN (7x7) |
||
NXP |
IC FS86 SYSTEM BASIS CHIP ASIL
|
pacote: - |
Request a Quote |
|
- | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
AUTO SBC
|
pacote: - |
Request a Quote |
|
30µA | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
SAFETY SYSTEM BASIS CHIP WITH LO
|
pacote: - |
Request a Quote |
|
29µA | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
PF4210
|
pacote: - |
Request a Quote |
|
- | 2.8V ~ 4.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
POWER MANAGEMENT IC, PRE-PROG, 3
|
pacote: - |
Request a Quote |
|
- | - | - | Surface Mount, Wettable Flank | 32-PowerWFQFN | 32-HWQFN (5x5) |
||
NXP |
IC
|
pacote: - |
Request a Quote |
|
30µA | 5.5V ~ 40V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-HVQFN (7x7) |
||
NXP |
POWER MANAGEMENT IC, PRE-PROG, 4
|
pacote: - |
Request a Quote |
|
- | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 40-VFQFN Exposed Pad | 40-HVQFN (6x6) |
||
NXP |
IC FS86 SYSTEM BASIS CHIP ASIL
|
pacote: - |
Request a Quote |
|
- | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |