Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 2:8 1.5GHZ 48QFN
|
pacote: - |
Estoque384 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | 1.5 GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:12 1.5GHZ 56QFN
|
pacote: - |
Estoque510 |
|
1 | 2:12 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | 1.5 GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microchip Technology |
IC CLK BUFFER 2:8 250MHZ 48VQFN
|
pacote: - |
Request a Quote |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVDS, PECL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN (6x6) |
||
Microchip Technology |
IC CLK BUFFER 2:12 250MHZ 56VQFN
|
pacote: - |
Request a Quote |
|
1 | 2:12 | Yes/Yes | CML, HCSL, LVDS, PECL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-VQFN (8x8) |
||
Microchip Technology |
OS81082AHR-C2A-010500
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:4 250MHZ 16VQFN
|
pacote: - |
Request a Quote |
|
1 | 1:4 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:20 250MHZ 80GQFN
|
pacote: - |
Estoque4.410 |
|
1 | 1:20 | Yes/Yes | Differential or Single-Ended | HCSL | 250 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 80-WFQFN Dual Rows, Exposed Pad | 80-GQFN (6x6) |
||
Microchip Technology |
IC CLK BUFFER 1:2 250MHZ 16VQFN
|
pacote: - |
Estoque1.440 |
|
1 | 1:2 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:9 28PLCC
|
pacote: - |
Request a Quote |
|
1 | 2:9 | Yes/Yes | PECL, TTL | PECL | - | 4.75V ~ 5.25V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.48x11.48) |
||
Microchip Technology |
IC CLK BUFFER 1:4 250MHZ 16VQFN
|
pacote: - |
Estoque1.440 |
|
1 | 1:4 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 400MHZ 20QFN
|
pacote: - |
Estoque38.748 |
|
1 | 1:4 | Yes/Yes | Differential or Single-Ended | HCSL | 400 MHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (4x4) |
||
Microchip Technology |
AUTOMOTIVE 4 OUTPUT CMOS BUFFER
|
pacote: - |
Request a Quote |
|
1 | 1:4 | No/No | - | LVCMOS | 160 MHz | 1.71V ~ 3.63V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:8 250MHZ 48VQFN
|
pacote: - |
Request a Quote |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVDS, PECL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-VQFN (6x6) |
||
Microchip Technology |
IC CLK BUFFER 1:2 150MHZ 6DFN
|
pacote: - |
Estoque690 |
|
1 | 1:2 | No/No | LVCMOS, Sine Wave | LVCMOS | 150 MHz | 1.62V ~ 3.63V | -40°C ~ 85°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (2x1.3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 400MHZ 20QFN
|
pacote: - |
Estoque2.211 |
|
1 | 1:2 | Yes/Yes | Differential or Single-Ended | HCSL | 400 MHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (4x4) |
||
Microchip Technology |
IC CLK BUFFER 1:4 250MHZ 16VQFN
|
pacote: - |
Estoque5.583 |
|
1 | 1:4 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:12 250MHZ 56VQFN
|
pacote: - |
Estoque780 |
|
1 | 2:12 | Yes/Yes | CML, HCSL, LVDS, PECL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-VQFN (8x8) |
||
Microchip Technology |
IC CLK BUFFER 1:2 250MHZ 16VQFN
|
pacote: - |
Estoque1.440 |
|
1 | 1:2 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 250MHZ 16VQFN
|
pacote: - |
Estoque1.026 |
|
1 | 1:4 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:8 250MHZ 48VQFN
|
pacote: - |
Request a Quote |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVDS, PECL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-VQFN (6x6) |
||
Microchip Technology |
IC CLK BUFFER 1:4 250MHZ 16VQFN
|
pacote: - |
Estoque1.440 |
|
1 | 1:4 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:12 250MHZ 56VQFN
|
pacote: - |
Request a Quote |
|
1 | 2:12 | Yes/Yes | CML, HCSL, LVDS, PECL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-VQFN (8x8) |
||
Microchip Technology |
IC CLK BUFFER 1:20 250MHZ 80GQFN
|
pacote: - |
Estoque75 |
|
1 | 1:20 | Yes/Yes | Differential or Single-Ended | HCSL | 250 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 80-WFQFN Dual Rows, Exposed Pad | 80-GQFN (6x6) |
||
Microchip Technology |
AUTOMOTIVE 4 OUTPUT CMOS BUFFER
|
pacote: - |
Request a Quote |
|
1 | 1:4 | No/No | - | LVCMOS | 160 MHz | 1.71V ~ 3.63V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:8 250MHZ 48VQFN
|
pacote: - |
Estoque19.725 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVDS, PECL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN (6x6) |
||
Microchip Technology |
OS81082AHR-B1A-010308
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:2 250MHZ 16VQFN
|
pacote: - |
Request a Quote |
|
1 | 1:2 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 250MHZ 8VDFN
|
pacote: - |
Estoque11.304 |
|
1 | 1:2 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 8-VFDFN | 8-VDFN (1.6x1.4) |