Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
|
pacote: - |
Estoque7.680 |
|
18 (2 x 9) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
||
Aries Electronics |
CONN IC DIP SOCKET 16POS GOLD
|
pacote: - |
Estoque7.686 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 18POS TIN
|
pacote: - |
Estoque19.596 |
|
18 (2 x 9) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
||
Aries Electronics |
CONN IC DIP SOCKET 12POS GOLD
|
pacote: - |
Estoque8.676 |
|
12 (2 x 6) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 16POS GOLD
|
pacote: - |
Estoque7.092 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
pacote: - |
Estoque9.348 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 10POS GOLD
|
pacote: - |
Estoque14.448 |
|
10 (2 x 5) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
||
Aries Electronics |
CONN IC DIP SOCKET 16POS GOLD
|
pacote: - |
Estoque6.102 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
||
Aries Electronics |
CONN IC DIP SOCKET 12POS GOLD
|
pacote: - |
Estoque8.028 |
|
12 (2 x 6) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 40POS GOLD
|
pacote: - |
Estoque8.880 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 10POS GOLD
|
pacote: - |
Estoque20.370 |
|
10 (2 x 5) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 10POS GOLD
|
pacote: - |
Estoque20.508 |
|
10 (2 x 5) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 32POS GOLD
|
pacote: - |
Estoque7.056 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 10POS TIN
|
pacote: - |
Estoque8.892 |
|
10 (2 x 5) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
||
Aries Electronics |
CONN SOCKET SIP 25POS TIN
|
pacote: - |
Estoque10.416 |
|
25 (1 x 25) | 0.100" (2.54mm) | Tin | 50µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 50µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 20POS GOLD
|
pacote: - |
Estoque8.676 |
|
20 (1 x 20) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
pacote: - |
Estoque6.744 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 48POS GOLD
|
pacote: - |
Estoque8.844 |
|
48 (2 x 24) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS TIN
|
pacote: - |
Estoque6.600 |
|
14 (2 x 7) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
|
pacote: - |
Estoque7.524 |
|
18 (2 x 9) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 10POS GOLD
|
pacote: - |
Estoque17.850 |
|
10 (2 x 5) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS GLD
|
pacote: - |
Estoque6.972 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN SOCKET SIP 25POS GOLD
|
pacote: - |
Estoque7.398 |
|
25 (1 x 25) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS TIN
|
pacote: - |
Estoque6.588 |
|
28 (2 x 14) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS TIN
|
pacote: - |
Estoque9.540 |
|
40 (2 x 20) | 0.100" (2.54mm) | Tin | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 10µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS TIN
|
pacote: - |
Estoque19.062 |
|
28 (2 x 14) | 0.100" (2.54mm) | Tin | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 10µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 12POS GOLD
|
pacote: - |
Estoque7.848 |
|
12 (2 x 6) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
pacote: - |
Estoque9.156 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
pacote: - |
Estoque6.480 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS TIN
|
pacote: - |
Estoque14.190 |
|
14 (2 x 7) | 0.100" (2.54mm) | Tin | 50µin (1.27µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 50µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |